From September 15 to 19, students of Vidzeme University of Applied Sciences (ViA) took part in the E³UDRES² Intensive I Living Labs event, hosted this autumn at St. Pölten University of Applied Sciences in Austria. The program brought together more than 130 students from various European countries to tackle regional challenges with creativity and innovative ideas.
Throughout the event, participants explored both the positive aspects and potential risks of digital media, engaged in discussions on socially significant topics, and learned new methods for solving real business problems. Students strengthened their critical thinking skills, worked in international teams, and experienced diverse cultures.
ViA student Sofija, bachelor’s program in "Communication and Public Relations" shared her impressions: “New contacts, new experiences, and a wonderful university campus. The week was filled with new knowledge, a friendly atmosphere, and the opportunity to get to know the culture of students from other countries.” Meanwhile, ViA IT student Marks summed up his experience in three words: “Creative, dynamic, innovative.”
During the week, participants collaborated with several regional organizations and companies, including Commit.at, Stadtmuseum St. Pölten, Wasbishergeschah.podcast, and HTL Waidhofen. In addition to intensive teamwork, the program offered cultural and team-building activities, excursions, and opportunities to establish new international contacts.
Why join I Living Labs?
I Living Labs provide an innovative learning approach focused on solving real-world challenges. The program takes place twice a year – in spring and autumn – and offers students:
- practical experience in addressing company and organizational challenges,
- teamwork in international groups,
- new contacts and cultural exchange,
- greater confidence in their future skills.
Interested in other E³UDRES² events? Contact ViA’s international office at
The event is part of E³UDRES² – the European University Alliance, co-funded by the Erasmus+ program.